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 MN102H81G
Type ROM (x 16-bit) x RAM (x 16-bit) x Package Minimum Instruction Execution Time Interrupts
MN102H81G 128 K 4K QFP084-P-1818E *Lead-free 83 ns (at 3.135 V to 3.465 V, 12 MHz) External (5 lines) Internal (28 lines) : Timer x 11, A/D x 1, Undefined command x 1, RESET x 1, OSD x 2, Serial x 1, I2C x 1, Caption x 2, Remote control x 1, Address coincidence x 4, HSYNCx 1, VSYNCx 1 8-bit timer x 10 Watchdog timer: 17-bit x 1 I2C x 1: for multimaster mode, bus line (output) has 2 systems Sync serial / UART x 1 * Built-in sync separator x 1
Timer Counter Serial Interface Caption I/O Pins A/D Inputs PWM Special Ports CRTC Notes I/O
30
* Common use
10-bit x 8-ch. (with S/H) 8-bit x 6-ch. Remote control reception 3-layer display (graphics, characters, splits) Remote control input discriminant circuit built-in, build-in NTSC video signal processing circuit, built-in 3-line comb filter
182
MAE00017BEM
MN102H81G
Pin Assignment
P07, ADIN7, VDAF P06, ADIN8, HDAF
P05, ADIN5
P04, ADIN4
P03, ADIN3
P02, ADIN2
P01, ADIN1
P00, ADIN0
/TESTMD
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
P15, RMIN, /IRQ7 *P16, SDA0 *P17, SCL0 P20, WDOUT P21, STOP, VOUT0 P27, SBT0 P30, SBD0 P31, SBO0 *P32, SDA1 *P33, SCL1 P34, PWM0 P35, PWM1 P36, PWM2 DVDD DVSS P22, SYSCLK *P23, TM5IO *P26, TM8IO P43, /RST P44, /IRQ0 P45, /IRQ1
64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84
10 11 12 13 14 15 16 17 18 19 20 1 2 3 4 5 6 7 8 9
43
SCOMP
DVDD
DVDD
AVDD
SIREF
BOUT
DVSS
AVSS
OSC2
OSC1
VCOI
PDO
42 41 40 39 38 37 36 35 34
GOUT ROUT VIREF VCOMP VMOUT AVDD FBPIN AVSS EW VOUT AVDD FSCOUT FSCIN FPCO AVSS FVCOI HOUT HDOWN EHTIN BEAMIN ABLIN
MN102H81G
33 32 31 30 29 28 27 26 25 24 23 22
21
P46, /IRQ2
P47, /IRQ3
VSYNC
P40, PWM4
AVDD
AVSS
VREFH
VREFM
MCOMPIN
CREFH
MVIN
CLH
PIPYIN
PIPVIN
PIPUIN
VREFL
MSCIN
MUIN
CLL
QFP084-P-1818E *Lead-free *5 V dielectric Nch open drain output pin
Support Tool
In-circuit Emulator
PX-ICE102H81-QFP084-P-1818E
CREFL
PIPYS
MAE00017BEM
2
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL


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